Z21 MAX BGA Chip Tin Station CPU Reballing Stencil Platform for iPhone 6-15 Pro Max A8-A17

Z21 MAX Chip Tin Station CPU Reballing Platform with A8-A17 Steel Mesh Precise Positioning for iPhone 6-15 Pro Max

Description:

MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone 6-15 Pro Max A8-A16 A17 pro CPU. MJ Z21 MAX CPU IC tin planting platform with steel mesh for iPhone CPU repair. MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 CPU

Features:

• 1. High-temperature resistance and abrasion resistance.

• 2. Imported alloy steel, metal fatigue resistance, make the product more durable.

• 3. Dirt-resistant, easy to clean.

• 4. High precision, Precise alignment Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.

• 5. The square holes and rounded corners are planted with tin and black nets to make each of your tin balls more rounded and fuller.

• 6. Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape.

• 7. High precision, no burrs, so that every mesh can be of the same size and not stuck.

• 8. Double magnet, super magnetic, accurate positioning without shaking.